The insulating layer reduces current leaks, leading to devices that are more power-efficient and faster than conventional silicon chips. In SOI devices, there is an insulating layer of silicon oxide separating the pure silicon top layer from the rest of the silicon wafer. More generally, it may allow researchers to better control the results of material fractures. The finding may help engineers improve the fabrication of silicon-on-insulator (SOI) electronics, a technology widely used in smartphones. The snap is produced by sound waves within the material that can also interact with the crack, and now researchers have demonstrated that this interaction can control the patterns left behind on the newly-created surfaces. ×Ī crack ripping through a material is usually accompanied by a snapping sound. In this experiment, lasers measure the speed of the crack front and piezoelectric sensors (only one shown, in blue) detect the surface deformation caused by sound waves in the material. A crack propagating in a silicon wafer can interact with the sound waves it generates in the material. Landru/SOITEC adapted by APS/ Alan Stonebraker Sound effects.
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